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Polymer Drilling Fluids
LIQUID PAC: This drispac polymer that has been proven effective in battling swelling clay and seepage loss. It also helps strengthen the wall-cake and will help prevent caving and sloughing in the hole. Added benefits include improved viscosity and hole-cleaning.
RING FREE: This liquid polymer is a low molecular weight, anionic thinner designed to break down clay swelling, expansion and hydration. It can be used to thin viscous muds, to increase pumpability, or to breakdown problem in-situ clays that are increasing torque and drag. This synthetic additive has a high temperature limit and is not subjected to bacterial degradation.
DUO VIS: DUO VIS xanthan gum is a high molecular weight biopolymer used for increasing rheology in water-based systems. Small quantities provide viscosity and weight material suspension for all water based mud systems. DUO-VIS has the unique ability to produce a fluid that is highly shear thinning while developing a true gel structure.
Kem-Tron (281) 261-5778, www.kemtron.com
CLAY-KATCH: Very low molecular weight liquid polymer with a high cationic charge. Used for clay inhibition instead of potassium chloride. Lower mud densities can be achieved by causing drill solids to be enmeshed with KEM-VIS additions and removed with hydrocyclones and decanter centrifuge liquid – solids separation equipment.
KEM-VIS: Medium molecular weight – anionic polyacrylamide in emulsion form that is specifically developed as a Viscosifier/Friction Reducer additive for water base drilling fluids. KEM-VIS is environmentally safe, contains no alkylphenols and has a category C toxicity classification. Improved hydraulic horsepower by reducing fluid turbulence at high Reynolds numbers, sweeping the cuttings from the hole when drilling with water. Improved viscosity in fresh water based drilling fluids and improved solids separation in side of hydrocylones due to “shear thinning” characteristics. Drill solids encapsulation and improved wellbore lubricity - allows for less bentonite consumption and less colloidal solids to provide improved bit penetration rates.